MultiCore® Solder and
Flux Material
The Multicore® line of
solder pastes and fluxes are designed to meet the rigorous demands of a variety
of electronic manufacturing soldering processes. Whether your process requires
long abandon times, wide process windows, or high-speed printing, we have a
Multicore® solder and plus material to suit your needs.
Multicore® Solder & Flux Materials
Multicore® No-Clean Fluxes Application:
Spray/Foam
Multicore® Water Wash Fluxes-IPA Based
Multicore® Cored Wire
Multicore® Cleaners
Loctite® Brand Chipbonder® Syringe Dispense Adhesives
Thermal Management Adhesives
MultiCore®
Solder a nd
Flux Material
The Multicore®
line of solder pastes and fluxes are designed to meet the rigorous demands of a
variety of electronic manufacturing soldering processes. Whether your process
requires long abandon times, wide process windows, or
high-speed printing, we have a Multicore® solder and plus material to suit
your needs.
Multicore® Solder & Flux Materials For more
information or to order Call 1-800-323-5158
MP200 Solder Paste WIDE PROCESS WINDOW
A high activity, soft, colorless, low residue, no
clean , solder paste that exhibits excellent print definition with long open and
abandon time.
Alloy: 6N62/SN63 63S4 Anti-Tombstoning
% Metal Load 90 90.5 Tack: (G../MM2) 1.1 Print Speed 25-200
CR36™ No Clean Solder Paste
HIGHEST ACTIVITY OFFERING A high activity colorless
residue paste. Exhibits good abandon time, long stencil life and minimum hot
slump.
Alloy: 6N62/SN63
% Metal Load 89.5 Tack: (G../MM2) 13-16 Print Speed 20-200
LF320™ Lead Free Paste
WIDE PROCESS WINDOW A no clean flux system specially formulated for Pb-free
alloys.High temperature tolerance and wide printing capability.
Alloy: 96SC
% Metal Load 88 Tack: (G../MM2) 1.2 Print Speed 20-150
WS200™ Water Wash Paste
WIDE PROCESS WINDOW High performance water washable solder paste. Residues are
readly removed with D1 Water, without the need for a saponifier.
Alloy: SN62/SN63
% Metal Load 90.5 Tack: (G../MM2) 0.8 Print Speed 25-100
Multicore® No-Clean Fluxes Application: Spray/Foam
X32-10™ No-Clean Flux
- Clear Residue Wide Process Window A general
pupose halide-free low solids flux which leaves clean, dry boards after wave
soldering. Suitable for foam and spray flux application systems.
% Solids: 2.2 % Halides: Zero Acid Value: 15.3 IPC Class: REMO
MF200™ Liquid Flux -
Contract Manufacturing Grade-Lead-Free
Compatible A general purpose halide-free flux with sustained activity to extend
flux life in dual wave and PB-free wave soldering applications. Suitable for
spray flux application systems. Solvent-based flux may be thinned with IPA.
% Solids: 6.4 % Halides: Zero Acid Value: 48.5 IPC Class: ORMO
MF300™ VOC-Free-Clear
Residue-Resin-Lead-Free
Compatible General purpose VOC-Free (water based), no clean, halide free and
resin free flux with special formulation to minimize solder balling. Compatible
with Pb-free processes. % Solids: 4.6% Halides: Zero Acid Value: 37 IPC Class:
ORMO
MRF301™
IPA-Based Rosin Flux-Lead-Free
Compatible Higher solids flux for better wetting on reduced solderability
surfaces and to minimize bridging on complex geometries. Fully Bp-Free and dual
wave compatible. Solvent based flux may be thinned with IPA. % Solids: 6.5 %
Halides: Zero Acid Value: 41 IPC Class: ROMO
Multicore®
Water Wash Fluxes-IPA Based
Hydro-X/20™
High Activity Flux A high activity water washable flux designed for the
soldering of the most difficult electronic assemblies. Unique activator package
enables a wider process window and the soldering of all common electronic
surfaces with ease.Residues are readily and completely removed by water wash
after soldering. Suitable for lead-free wave soldering.
% Solids: 20 % Halides: 1.0 Acid Value: 24
Multicore®
Cored Wire
Multicore® Cored Wire Typical wire diameters are 0.015, 0.024, 0.032. 0.040, and
0.064 In
400™ Halide-free,
no clean, clear residue, increased flux content for improved wetting. Halide
Content: Zero
502™ No clean,
clear residue, minimal activation for increased wetting. Halide Content: 0.2%
Hydro-X™
High Activity water washable. Halide Content: 3%
Multicore® Cleaners
Pozone™ SCO1™
Designed for the stencil cleaning and hand cleaning
of process soldering residues. Highly effective cleaner that dries rapidy.
Loctite® Brand
Chipbonder® Syringe Dispense Adhesives
Cornerbond 3515™ Specially formulated to
allow component realignment in double sided reflow applications.
Color: Black Cure:In solid paste reflow cycle after paste has reached
liquidation. Process Method: Syringe Dispense Self-Alignment
Storage: (Protect from heat 5C- + 3C Shelf Life: 6 months DOM Syringe Size: 30
ml STD
3621™
High performance for ultra high-speed syringe dispense.
Good green strength. Superior humidity resisdtance and electrical properties.
Can be used in lead-free solder applications.Room temperature storage capable.
Color: Red Cure: 90 sec. @ 150C or 2-3 min @ 125C Process Method: Very high
speed Syringe Dispensing - 47,000 DPH capable Jettable
Storage: (Protect from heat 5C- + 3C or 8C-21C for 30 days Shelf Life: 10 months
DOM Syringe Size: 10 and 30 ml STD, 30 ml Iwashita Clear syringe, 20 ml Panasert
syringe, 30 ml Fuji syringe.
For more information and/or to
order call 1-800-323-5158
or Email
gluguru@on-hand.com
| 
